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OPA615IDGST - Texas Instruments

Description: Transconductance Amplifiers Wide BW DC Restor Circuit

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PCB Footprints
OPA615IDGST - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS (S-PDSO-G10)
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3D Models
OPA615IDGST - Texas Instruments  - 3D model - Small Outline Packages - DGS (S-PDSO-G10)
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OPA615IDGST Details

  • Manufacturer Part Number:

    OPA615IDGST

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    SAMPLE AND HOLD CIRCUIT

  • Analog Input Voltage-Max:

    3 V

  • Analog Input Voltage-Min:

    -3 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    17 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

OPA615IDGST Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA615IDGST involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth of the amplifier. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes for guidance.
  • The maximum power dissipation of OPA615IDGST is 1.4W. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
  • Yes, OPA615IDGST can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. A buffer configuration can also help to improve the output impedance and reduce distortion.
  • To filter out noise and interference, use a combination of passive and active filtering techniques. Add bypass capacitors to the power supply lines, use a low-pass filter at the input, and consider adding a noise filter stage before the amplifier. Shielding and grounding techniques can also help to reduce electromagnetic interference.

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OPA615IDGST Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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