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OPA660AU - Texas Instruments

Description: Wide Bandwidth Operational Transconductance Amplifier and Buffer, SO-8

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OPA660AU - Texas Instruments - PCB symbol
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PCB Footprints
OPA660AU - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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3D Models
OPA660AU - Texas Instruments - 3D model - Small Outline Packages - D0008A
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OPA660AU Details

  • Manufacturer Part Number:

    OPA660AU

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SO-8

  • Pin Count:

    8

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Neg Supply Voltage-Max (Vsup):

    -5.5 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

OPA660AU Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, with a solid ground plane and short, direct traces to the input and output pins. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain-setting resistors are properly matched, and the feedback network is properly compensated. Also, avoid capacitive loads and use a low-ESR capacitor for decoupling. TI also recommends using the OPA660AU's internal compensation capacitor (Ccomp) for stability.
  • The maximum power dissipation for the OPA660AU is 1.4W, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 90°C/W. Ensure that the device is properly heat-sinked to prevent overheating.
  • The OPA660AU is rated for operation up to 125°C, but its performance may degrade at high temperatures. TI recommends derating the device's power dissipation and ensuring proper heat-sinking to prevent overheating. Consult the datasheet for more information on temperature-related specifications.
  • TI recommends using ESD protection devices, such as TVS diodes or ESD arrays, to protect the OPA660AU from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.

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OPA660AU Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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