SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.45 mm
Slew Rate-Min:
525 V/us
Slew Rate-Nom:
1000 V/us
Subcategory:
Operational Amplifier
Supply Current-Max:
20.8 mA
Supply Voltage Limit-Max:
6.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
800000
Voltage Gain-Min:
10000
Wideband:
YES
Width:
1.6 mm
OPA843IDBVT Frequently Asked Questions (FAQs)
A good PCB layout for OPA843IDBVT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
To ensure stability, ensure that the gain-setting resistors are properly matched, and the capacitive load is minimized. Also, add a small capacitor (e.g., 10pF) in parallel with the feedback resistor to improve stability.
The maximum power dissipation of OPA843IDBVT is 1.4W. To calculate power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
Yes, OPA843IDBVT is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
To protect OPA843IDBVT from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines.
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OPA843IDBVT Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
