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OPA858QDSGRQ1 - Texas Instruments

Description: High Speed Operational Amplifiers Automotive 5.5-GHz gain bandwidth, decompensated transimpedance amplifier with FET input

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OPA858QDSGRQ1 - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DSG (S-PWSON-N8)+
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OPA858QDSGRQ1 - Texas Instruments  - 3D model - Small Outline No-lead - DSG (S-PWSON-N8)+
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OPA858QDSGRQ1 Details

  • Manufacturer Part Number:

    OPA858QDSGRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000005 µA

  • Bandwidth (3dB)-Nom:

    1200 MHz

  • Bias Current-Max (IIB) @25C:

    0.000005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.000005 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    2000 V/us

  • Supply Current-Max:

    24 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500000

  • Voltage Gain-Min:

    3981.071706

  • Wideband:

    YES

  • Width:

    2 mm

OPA858QDSGRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the OPA858QDSGRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. A 4-layer PCB with a dedicated analog ground layer is recommended.
  • To handle the high GBP of the OPA858QDSGRQ1, use a compensation capacitor (e.g., 10-100 pF) between the output and the inverting input to reduce oscillations and improve stability. Additionally, ensure the feedback network is properly designed to match the op-amp's GBP.
  • The OPA858QDSGRQ1 can drive capacitive loads up to 1 nF without oscillating, but it's recommended to limit the load capacitance to 100 pF or less to ensure stability. If a larger capacitive load is required, consider adding a series resistor or using a buffer stage.
  • To minimize noise and EMI, use a low-noise power supply, add decoupling capacitors (e.g., 10 uF and 100 nF) close to the power pins, and consider using a shielded enclosure or a metal can package for the op-amp. Additionally, keep the analog and digital grounds separate and use a star-grounding configuration.
  • The thermal resistance (RθJA) of the OPA858QDSGRQ1 package is approximately 45°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 45°C above the ambient temperature.

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OPA858QDSGRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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