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OPA875IDGKR - Texas Instruments

Description: Single 2:1 High-Speed Video Multiplexer

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OPA875IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - OPA875IDGKR
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OPA875IDGKR Details

  • Manufacturer Part Number:

    OPA875IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    VIDEO MULTIPLEXER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    70 dB

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    12 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    60 ns

  • Switch-on Time-Max:

    9 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

OPA875IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA875IDGKR datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and ensure optimal performance.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, TI recommends using a low-ESR capacitor (e.g., 10nF to 100nF) in parallel with the output capacitor to improve stability. It's also crucial to minimize parasitic capacitance and inductance in the circuit.
  • The maximum power dissipation of OPA875IDGKR is dependent on the ambient temperature and the package thermal resistance. According to the datasheet, the maximum power dissipation is 1.4W at 25°C. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • Yes, OPA875IDGKR can operate in high-temperature environments, but there are limitations. The device is specified to operate from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Above 125°C, the device's performance and reliability may degrade. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
  • To protect OPA875IDGKR from EMI and RFI, use proper shielding, grounding, and filtering techniques. TI recommends using a shielded enclosure, connecting the device's exposed pad to a solid ground plane, and using ferrite beads or common-mode chokes to filter out high-frequency noise. Additionally, use a low-pass filter or a pi-filter to attenuate high-frequency signals.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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