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OPA890IDBVT - Texas Instruments

Description: Low Power, Wideband, Voltage Feedback Operational Amplifier with Disable

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PCB Footprints
OPA890IDBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
OPA890IDBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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OPA890IDBVT Details

  • Manufacturer Part Number:

    OPA890IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    2 µA

  • Bias Current-Max (IIB) @25C:

    1.6 µA

  • Common-mode Reject Ratio-Min:

    61 dB

  • Common-mode Reject Ratio-Nom:

    67 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.35 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    175 V/us

  • Slew Rate-Nom:

    500 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130000

  • Voltage Gain-Min:

    400

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA890IDBVT Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA890IDBVT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain resistor (Rg) is less than or equal to 1 kΩ, and the feedback capacitor (Cf) is less than or equal to 10 pF. Also, use a low-ESR capacitor for decoupling and keep the layout compact.
  • The maximum power dissipation of OPA890IDBVT is 750 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • Yes, OPA890IDBVT is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, ensure that the PCB is designed with ESD protection in mind, and handle the device with ESD-safe equipment and procedures.

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OPA890IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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