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OPA991SIDBVR - Texas Instruments

Description: Operational Amplifiers - Op Amps 40-V, single 4.5MHz, rail-to-rail input/output, low-offset-voltage, low-noise op amp 6-SOT-23 -40 to 125

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PCB Footprints
OPA991SIDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
OPA991SIDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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OPA991SIDBVR Details

  • Manufacturer Part Number:

    OPA991SIDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-06-05

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    84 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    750 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -21 V

  • Neg Supply Voltage-Nom (Vsup):

    -4 V

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    21 V/us

  • Supply Current-Max:

    0.685 mA

  • Supply Voltage Limit-Max:

    21 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4500

  • Voltage Gain-Min:

    158489.3192

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA991SIDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA991SIDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain is set correctly, and the feedback network is properly designed. A good rule of thumb is to keep the gain below 10 and use a feedback capacitor value that is at least 10 times the input capacitance. Additionally, use a series resistor in the feedback path to dampen oscillations.
  • The maximum power dissipation of OPA991SIDBVR is 1.4W. However, this can be limited by the thermal resistance of the package and the PCB. Ensure that the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • Yes, OPA991SIDBVR is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may be limited. Ensure that the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • To protect OPA991SIDBVR from ESD damage, use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins. Additionally, ensure that the PCB is designed with ESD protection in mind, and handle the device with ESD-safe equipment and procedures.

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OPA991SIDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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