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PA10M/883 - Apex Microtechnology

Description: 100V, 5A, High Temp Power Amplifier with High Gain Bandwidth, Temperature operating range – -55°C to +125°C (PA10A), Voltage supply operation – ±10V to ±50V.

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PA10M/883 - Apex Microtechnology PCB footprint - Other - Other - CE
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PA10M/883 Details

  • Manufacturer Part Number:

    PA10M/883

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-3

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Apex Microtechnology Inc

  • YTEOL:

    3

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.03 µA

  • Bias Current-Max (IIB) @25C:

    0.03 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    74 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    12000 µV

  • JESD-30 Code:

    O-MBFM-P8

  • JESD-609 Code:

    e0

  • Low-Offset:

    NO

  • Neg Supply Voltage Limit-Max:

    -50 V

  • Neg Supply Voltage-Nom (Vsup):

    -40 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Equivalence Code:

    CAN8/9,.5FL

  • Package Shape:

    ROUND

  • Package Style:

    FLANGE MOUNT

  • Power:

    YES

  • Qualification Status:

    Not Qualified

  • Screening Level:

    38535Q/M; 38534H; 883B

  • Slew Rate-Min:

    2 V/us

  • Supply Current-Max:

    75 mA

  • Supply Voltage Limit-Max:

    50 V

  • Supply Voltage-Nom (Vsup):

    40 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    BOTTOM

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    63000

PA10M/883 Frequently Asked Questions (FAQs)

  • Apex Microtechnology recommends a 4-layer PCB with a dedicated thermal plane, and thermal vias under the device to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the thermal plane.
  • To ensure reliable operation at high temperatures, Apex recommends derating the output current and voltage, and using a heat sink with a thermal interface material. Additionally, the device should be operated within the recommended junction temperature range.
  • Apex recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The capacitors should be placed as close as possible to the device pins to minimize parasitic inductance.
  • Apex recommends using overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. The OVP circuit should be designed to trigger at 1.5 times the maximum rated voltage, and the OCP circuit should be designed to trigger at 1.5 times the maximum rated current.
  • Apex recommends a soldering profile with a peak temperature of 260°C, and a dwell time of 10-30 seconds. The device should be soldered using a no-clean flux, and the PCB should be cleaned after soldering to prevent contamination.

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PA10M/883 Overview

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