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PA50 - Apex Microtechnology

Description: The PA50 is a 40A, 100V power operational amplifier featuring 200kHz of power bandwidth and a 50V/µs slew rate. With this combination of high current output, bandwidth, slew rate, and 400 watts of internal power dissipation, the PA50 is targeted for applications in the semi-cap equipment market. Another exceptional feature of the PA50 is its boost voltage inputs that allow the small signal portion of the amplifier to operate at a higher voltage than the high current output stage. The amplifier is then bias

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PCB Footprints
PA50 - Apex Microtechnology PCB footprint - Other - Other - CR
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PA50 - Apex Microtechnology  - 3D model - Other - CR
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PA50 Details

  • Manufacturer Part Number:

    PA50

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFM

  • Package Description:

    ROHS COMPLIANT, POWER, HERMETIC SEALED, MO-127, DIP-12

  • Pin Count:

    12

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Apex Microtechnology Inc

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-MDFM-P12

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -50 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP12,1.2,200TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Slew Rate-Min:

    50 V/us

  • Supply Current-Max:

    36 mA

  • Supply Voltage Limit-Max:

    50 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    5.08 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    50100

  • Wideband:

    NO

PA50 Frequently Asked Questions (FAQs)

  • Apex Microtechnology recommends a 4-layer PCB with a solid ground plane, and a thermal pad connected to a heat sink or a thermal management system to maintain a junction temperature below 125°C.
  • Use a voltage regulator or a voltage limiter to prevent overvoltage, and a current limiter or a fuse to prevent overcurrent. Additionally, consider using a protection circuit with a voltage clamp and a current sense resistor.
  • The PA50 has a nominal input impedance of 50 ohms and a nominal output impedance of 50 ohms. For maximum power transfer, match the input and output impedance to 50 ohms using a pi-network or a transmission line.
  • Use a shielded enclosure, keep the PA50 away from sensitive circuits, and use EMI filters or absorbers. Additionally, ensure proper grounding and decoupling of the power supply and signal lines.
  • The SOA for the PA50 is defined by the maximum voltage, current, and power dissipation ratings. Prevent device damage by ensuring the operating conditions are within the SOA, and by using protection circuits and thermal management systems.

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PA50 Overview

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