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PA76 - Apex Microtechnology

Description: Power Dual Operational Amplifier

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PCB Footprints
PA76 - Apex Microtechnology PCB footprint - Other - Other - CE
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PA76 - Apex Microtechnology  - 3D model - Other - CE
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PA76 Details

  • Manufacturer Part Number:

    PA76

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-204AA

  • Package Description:

    ROHS COMPLIANT, TO-3, 8 PIN

  • Pin Count:

    2

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Apex Microtechnology Inc

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Bias Current-Max (IIB) @25C:

    0.5 µA

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    O-MBFM-P8

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Equivalence Code:

    CAN8/9,.5FL

  • Package Shape:

    ROUND

  • Package Style:

    FLANGE MOUNT

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    40 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    BOTTOM

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    28100

  • Wideband:

    NO

PA76 Frequently Asked Questions (FAQs)

  • Apex Microtechnology recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation at high temperatures, Apex recommends derating the output current and voltage, and using a heat sink with a thermal interface material. Additionally, the device should be operated within the recommended junction temperature range.
  • The PA76 has internal ESD protection, but handling precautions are still necessary. Apex recommends using an ESD wrist strap, mat, or workstation, and handling the device by the package body, not the pins.
  • Yes, the PA76 can be used in switching applications, but Apex recommends ensuring the device is operated within the recommended frequency range, and using a suitable output filter to minimize ringing and overshoot.
  • Apex recommends using a pi-filter (R-C-R) or a T-filter (L-C-R) at the input and output to minimize noise and ripple. The filter components should be selected based on the specific application requirements.

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PA76 Overview

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