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PAC1931T-I/J6CX - Microchip

Description: DC POWER/ENERGY MONITOR W/ACCUM, 85DEG C ROHS COMPLIANT: YES

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PAC1931T-I/J6CX - Microchip - PCB symbol
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PCB Footprints
PAC1931T-I/J6CX - Microchip PCB footprint - BGA - BGA - WLCSP-16--
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PAC1931T-I/J6CX - Microchip - 3D model - BGA - WLCSP-16--
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PAC1931T-I/J6CX Details

  • Manufacturer Part Number:

    PAC1931T-I/J6CX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    WLCSP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    28 Weeks

  • Date Of Intro:

    2019-08-22

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    2.225 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.679 mm

  • Supply Current-Max (Isup):

    0.675 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.17 mm

PAC1931T-I/J6CX Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the PAC1931T-I/J6CX involves keeping the device close to the sense resistors, using a 4-layer PCB with a solid ground plane, and minimizing the distance between the device and the sense resistors. Additionally, it's recommended to use a Kelvin connection to the sense resistors to reduce noise and improve accuracy.
  • Calibration of the PAC1931T-I/J6CX involves adjusting the gain and offset of the current and voltage channels to match the specific application requirements. This can be done using the device's built-in calibration registers or through external calibration using a precision voltage source and current source.
  • The PAC1931T-I/J6CX can measure currents up to 32V and 3A. In overcurrent conditions, the device has built-in overcurrent protection that limits the current to prevent damage to the device and the system. The device also has an overcurrent detection feature that can trigger an interrupt or reset the device.
  • The PAC1931T-I/J6CX has built-in noise filtering and averaging capabilities to minimize the impact of noise and interference. To further minimize the impact of noise, it's recommended to use a low-pass filter on the input signals, use a shielded cable for the sense lines, and keep the device and sense resistors away from noisy components and cables.
  • The power consumption of the PAC1931T-I/J6CX is typically around 1.5mA. To minimize power consumption, it's recommended to use the device's low-power mode, reduce the sampling rate, and use a low-power microcontroller or system-on-chip (SoC) to interface with the device.

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PAC1931T-I/J6CX Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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