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PAC1933T-I/J6CX - Microchip

Description: Current Monitor Regulator High-Side 16-WLCSP (2.23x2.17)

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PCB Footprints
PAC1933T-I/J6CX - Microchip PCB footprint - BGA - BGA - 16-Ball Wafer Level Chip Scale Package (CS)
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3D Models
PAC1933T-I/J6CX - Microchip  - 3D model - BGA - 16-Ball Wafer Level Chip Scale Package (CS)
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PAC1933T-I/J6CX Details

  • Manufacturer Part Number:

    PAC1933T-I/J6CX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    WLCSP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    28 Weeks

  • Date Of Intro:

    2019-05-03

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    2.225 mm

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.679 mm

  • Supply Current-Max (Isup):

    0.675 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.17 mm

PAC1933T-I/J6CX Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the PAC1933T-I/J6CX involves keeping the device close to the sense resistors, using a 4-layer PCB with a solid ground plane, and minimizing the distance between the device and the sense resistors. Additionally, it is recommended to use a Kelvin connection to the sense resistors to reduce noise and improve accuracy.
  • Calibration of the PAC1933T-I/J6CX involves adjusting the gain and offset of the current and voltage measurements using the device's internal calibration registers. The calibration process typically involves applying known current and voltage levels to the device and adjusting the registers to achieve accurate measurements.
  • The PAC1933T-I/J6CX can measure currents up to 30A, and it has built-in overcurrent protection that limits the current to prevent damage to the device. In the event of an overcurrent condition, the device will enter a high-impedance state to prevent damage.
  • The PAC1933T-I/J6CX has built-in noise filtering and averaging capabilities to minimize the impact of noise and interference. Additionally, precautions such as using a solid ground plane, minimizing trace lengths, and using shielding can help to reduce noise and interference.
  • The power consumption of the PAC1933T-I/J6CX is typically in the range of 1-2mA, depending on the operating mode and frequency. This is relatively low compared to other system components, and the device is designed to minimize power consumption while maintaining accurate measurements.

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PAC1933T-I/J6CX Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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