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PAM8615RHR - Diodes Incorporated

Description: Audio Amplifiers 16W STEREO /32W MONO CLASS-D AUDIO AMP

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PCB Footprints
PAM8615RHR - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-24
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3D Models
PAM8615RHR - Diodes Incorporated  - 3D model - Small Outline Packages - TSSOP-24
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PAM8615RHR Details

  • Manufacturer Part Number:

    PAM8615RHR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    3

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PAM8615RHR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PAM8615RHR near a thermal pad or a heat sink, and ensuring that there are no thermal barriers or obstacles nearby. The datasheet provides a recommended PCB layout, but it's also important to follow general thermal design guidelines, such as using a solid ground plane and minimizing the distance between the device and the thermal pad.
  • To optimize the output filter design, you should consider the output impedance of the PAM8615RHR, the load impedance, and the desired frequency response. A good starting point is to use a 2nd-order LC filter with a cutoff frequency around 100 kHz to 200 kHz. You can use filter design tools or simulation software to optimize the component values for your specific application.
  • The maximum power dissipation of the PAM8615RHR is dependent on the ambient temperature, package type, and thermal resistance. You can calculate the maximum power dissipation using the formula: Pd = (Tj - Ta) / Rth, where Pd is the power dissipation, Tj is the junction temperature, Ta is the ambient temperature, and Rth is the thermal resistance. The datasheet provides the thermal resistance values for different package types.
  • To protect the PAM8615RHR from overvoltage and undervoltage conditions, you can use voltage regulators or voltage supervisors to regulate the input voltage. You can also add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device. The datasheet provides guidelines for input voltage range and recommended operating conditions.
  • The recommended input capacitor value and type for the PAM8615RHR depend on the input voltage, output current, and desired ripple voltage. A good starting point is to use a 10 uF to 22 uF ceramic capacitor with a voltage rating of 25 V or higher. You can also use a film capacitor or a electrolytic capacitor, but make sure to follow the datasheet guidelines for input capacitor selection.

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