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PBHV9050T,215 - Nexperia

Description: PBHV9050T - 500 V, 150 mA PNP high-voltage low VCEsat (BISS) transistor

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PCB Footprints
PBHV9050T,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BAT721C,215
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3D Models
PBHV9050T,215 - Nexperia  - 3D model - SOT23 (3-Pin) - BAT721C,215
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PBHV9050T,215 Details

  • Manufacturer Part Number:

    PBHV9050T,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.15 A

  • Collector-Emitter Voltage-Max:

    500 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    80

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

PBHV9050T,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the thermal pad away from other components and ensuring good airflow around the device can help.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper thermal management, such as using a heat sink or thermal interface material, can also help. Additionally, consider derating the device's power handling at high temperatures.
  • The PBHV9050T,215 has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. For latch-up prevention, ensure that the device is operated within the recommended operating conditions, and consider adding external protection circuits if necessary.
  • The PBHV9050T,215 is an AEC-Q101 qualified device, making it suitable for automotive applications. However, for high-reliability applications, it's essential to follow the recommended operating conditions, and consider additional testing and validation to ensure the device meets the specific requirements of your application.
  • Follow the recommended soldering and assembly procedures outlined in the Nexperia application note AN11143, which provides guidelines for reflow soldering, wave soldering, and manual assembly.

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PBHV9050T,215 Overview

Use the download button to access the PBHV9050T,215 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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