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PCG0G122MCL1GS - Nichicon

Description: 1200 µF 4 V Aluminum - Polymer Capacitors Radial, Can - SMD 17mOhm 2000 Hrs @ 105°C

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Symbol
PCG0G122MCL1GS - Nichicon - PCB symbol
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PCB Footprints
PCG0G122MCL1GS - Nichicon PCB footprint - Capacitor Al Electrolytic - Capacitor Al Electrolytic - 10mm x 8mm
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3D Models
PCG0G122MCL1GS - Nichicon - 3D model - Capacitor Al Electrolytic - 10mm x 8mm
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PCG0G122MCL1GS Details

  • Manufacturer Part Number:

    PCG0G122MCL1GS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00

  • Manufacturer:

    Nichicon Corporation

  • YTEOL:

    7.35

  • Additional Feature:

    ESR IS MEASURED AT 100 KHZ

  • Capacitance:

    1200 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    10 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    17 mΩ

  • Height:

    8 mm

  • JESD-609 Code:

    e4

  • Leakage Current:

    0.96 mA

  • Length:

    10.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    4 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    200 mA

  • Size Code:

    4141

  • Surface Mount:

    YES

  • Tan Delta:

    0.12

  • Terminal Finish:

    Silver (Ag)

  • Terminal Shape:

    FLAT

  • Width:

    10.3 mm

PCG0G122MCL1GS Frequently Asked Questions (FAQs)

  • The recommended land pattern for PCG0G122MCL1GS is a rectangular pad with a size of 3.5mm x 2.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask opening of 3.2mm x 2.2mm.
  • PCG0G122MCL1GS is a moisture-sensitive device. It should be stored in a dry environment with a relative humidity of 20% or less. If the device is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before soldering.
  • The maximum reflow temperature for PCG0G122MCL1GS is 260°C. The device should not be exposed to temperatures above 260°C during the reflow process.
  • Yes, PCG0G122MCL1GS is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the device is properly secured to the PCB to prevent mechanical stress.
  • Yes, PCG0G122MCL1GS is compatible with lead-free soldering. The device is designed to withstand the higher temperatures required for lead-free soldering.

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PCG0G122MCL1GS Overview

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