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PD70201ILQ-TR - Microchip

Description: MICROCHIP - PD70201ILQ-TR - POE PD CONTROLLER, IEEE802.3AT, 85DEG C

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PCB Footprints
PD70201ILQ-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-Pin QFN 5 mm × 5 mm
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3D Models
PD70201ILQ-TR - Microchip  - 3D model - Quad Flat No-Lead - 32-Pin QFN 5 mm × 5 mm
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PD70201ILQ-TR Details

  • Manufacturer Part Number:

    PD70201ILQ-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLER

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    4.5 mA

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    55 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.3V

  • Width:

    5 mm

PD70201ILQ-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Ensure proper thermal management, use a reliable power supply, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced lifespan, decreased performance, and potential device failure. Ensure proper thermal management and monitoring to prevent overheating.
  • While possible, using a smaller heat sink may compromise thermal performance. Microchip recommends using a heat sink with a minimum footprint of 1 inch x 1 inch (2.54 cm x 2.54 cm) to ensure optimal heat dissipation.
  • Follow standard ESD precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging. Ensure all personnel handling the device are properly grounded.

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PD70201ILQ-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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