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PDTC114ET - Nexperia

Description: NPN resistor-equipped transistors

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PDTC114ET - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23(H=1.1mm)
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PDTC114ET - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23(H=1.1mm)
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PDTC114ET Details

  • Manufacturer Part Number:

    PDTC114ET

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Date Of Intro:

    1995-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BAIS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    2.5 pF

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.25 W

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    230 MHz

  • VCEsat-Max:

    0.1 V

PDTC114ET Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable operation at high temperatures, Nexperia recommends following the recommended operating conditions, using a heat sink or thermal interface material, and ensuring good airflow around the device. Additionally, the device should be soldered correctly, and the PCB should be designed to minimize thermal resistance.
  • Although the datasheet specifies a maximum input voltage of 5V, Nexperia recommends limiting the input voltage to 4.5V to ensure reliable operation and to prevent damage to the device.
  • Nexperia recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the PDTC114ET from electrostatic discharge. Additionally, proper handling and storage procedures should be followed to prevent ESD damage.
  • Nexperia recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.

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PDTC114ET Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for PDTC114ET, check out Findchips.com