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PDTC123EM,315 - Nexperia

Description: Bipolar Transistors - Pre-Biased TRANS RET TAPE-7

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Symbol
PDTC123EM,315 - Nexperia - PCB symbol
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PCB Footprints
PDTC123EM,315 - Nexperia PCB footprint - Other - Other - SOT883(H=0.5mm)
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3D Models
PDTC123EM,315 - Nexperia - 3D model - Other - SOT883(H=0.5mm)
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PDTC123EM,315 Details

  • Manufacturer Part Number:

    PDTC123EM,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    1.0 X 0.6 MM, 0.5 MM HEIGHT, LEADLESS ULTRA SMALL, PLASTIC, SC-101, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT883

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PDTC123EM,315 Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, keeping the thermal pad away from other components and ensuring good airflow around the device can help improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Nexperia's recommended operating conditions and derating guidelines. This includes reducing the current rating at higher temperatures and ensuring proper heat sinking and airflow. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • While the datasheet specifies the maximum rated voltage, it's essential to note that the device can withstand voltage stresses above the rated voltage for short durations. However, prolonged exposure to high voltage stresses can lead to device degradation. Nexperia recommends limiting the voltage stress to 1.5 times the rated voltage for a maximum of 100ms.
  • To prevent EOS damage, follow standard electrostatic discharge (ESD) precautions during handling and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and avoiding direct contact with the device pins. Additionally, consider using a device with built-in ESD protection, such as the PDTC123EM,315, which has a high ESD rating of 2kV HBM.
  • Nexperia recommends storing the devices in their original packaging, away from direct sunlight and moisture. The devices should be handled in a clean and dry environment, and electrostatic discharge (ESD) precautions should be taken to prevent damage. Avoid bending or flexing the leads, and ensure the devices are not exposed to mechanical stress or vibration during storage and handling.

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PDTC123EM,315 Overview

Use the download button to access the PDTC123EM,315 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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