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PDTC144EU - NXP

Description: 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR

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Symbol
PDTC144EU - NXP - PCB symbol
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PCB Footprints
PDTC144EU - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT323 (SC-70)
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3D Models
PDTC144EU - NXP - 3D model - SOT23 (3-Pin) - SOT323 (SC-70)
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PDTC144EU Details

  • Manufacturer Part Number:

    PDTC144EU

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SC-70

  • Package Description:

    PLASTIC, SC-70, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PDTC144EU Frequently Asked Questions (FAQs)

  • NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider using a thermistor or temperature sensor to monitor the device's temperature and implement thermal protection mechanisms if necessary.
  • Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, which is the absolute maximum rating. Exceeding this voltage can cause permanent damage to the device.
  • NXP recommends implementing ESD protection measures, such as using ESD-protection diodes or TVS (Transient Voltage Suppressor) devices, to protect the PDTC144EU from electrostatic discharge. Additionally, follow proper handling and storage procedures to minimize the risk of ESD damage.
  • NXP recommends following the JEDEC J-STD-020D.1 standard for soldering the PDTC144EU. The recommended soldering profile includes a peak temperature of 260°C, with a maximum time above 217°C of 30 seconds.

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PDTC144EU Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like PDTC1, or try a keyword search, such as Small Signal Bipolar Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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For a full list of alternate parts for PDTC144EU, check out Findchips.com