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PE0805FRF070R2L - Yageo Group

Description: Current Sense Resistors - SMD 200 mOhms 100ppm 0805 1% AEC-Q200

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PE0805FRF070R2L - Yageo Group - PCB symbol
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PCB Footprints
PE0805FRF070R2L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - PE0805FRF070R025L
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3D Models
PE0805FRF070R2L - Yageo Group - 3D model - Resistor Chip - PE0805FRF070R025L
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PE0805FRF070R2L Details

  • Manufacturer Part Number:

    PE0805FRF070R2L

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2.03 mm

  • Package Style:

    SMT

  • Package Width:

    1.27 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.2 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1581 V

PE0805FRF070R2L Frequently Asked Questions (FAQs)

  • The recommended land pattern for PE0805FRF070R2L is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, PE0805FRF070R2L is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • Yes, PE0805FRF070R2L is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's crucial to follow the recommended soldering profile to prevent damage to the component.
  • The MSL of PE0805FRF070R2L is MSL 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering.
  • Yes, PE0805FRF070R2L is designed to operate in humid environments, with a maximum operating humidity of 85% RH at 85°C. However, it's essential to ensure proper encapsulation and conformal coating to prevent moisture ingress.

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PE0805FRF070R2L Overview

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