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PE2010FKE070R04L - Yageo Group

Description: Current Sense Resistors - SMD 40 mOhms 50ppm 2010 1% AEC-Q200

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Symbol
PE2010FKE070R04L - Yageo Group - PCB symbol
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PCB Footprints
PE2010FKE070R04L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 2010_1
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3D Models
PE2010FKE070R04L - Yageo Group - 3D model - Resistor Chip - 2010_1
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PE2010FKE070R04L Details

  • Manufacturer Part Number:

    PE2010FKE070R04L

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.64 mm

  • Package Length:

    5.08 mm

  • Package Style:

    SMT

  • Package Width:

    2.54 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.04 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1414 V

PE2010FKE070R04L Frequently Asked Questions (FAQs)

  • The recommended land pattern for PE2010FKE070R04L is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the chip resistor's termination style, which is a bottom-side termination.
  • To handle thermal considerations for PE2010FKE070R04L, ensure that the PCB design provides adequate thermal relief paths to dissipate heat generated by the resistor. A minimum of 1mm clearance around the resistor is recommended to allow for air circulation and heat dissipation.
  • The maximum power rating for PE2010FKE070R04L is 0.25W. Exceeding this power rating can lead to overheating, reduced lifespan, or even failure of the resistor.
  • PE2010FKE070R04L is a general-purpose chip resistor and is not optimized for high-frequency applications. For high-frequency applications, consider using a high-frequency resistor with a lower ESL (equivalent series inductance) and a higher SRF (self-resonant frequency).
  • The moisture sensitivity level (MSL) of PE2010FKE070R04L is MSL 2, which means it can withstand a maximum of 4 days of exposure to a humidity level of 60% at 30°C before soldering.

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PE2010FKE070R04L Overview

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