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PEMD9,115 - Nexperia

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PEMD9,115 Details

  • Manufacturer Part Number:

    PEMD9,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    PLASTIC PACKAGE-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT666

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 4.7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    2.5 pF

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    230 MHz

  • VCEsat-Max:

    0.1 V

PEMD9,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for PEMD9009,115 should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers. This helps to reduce thermal resistance and improve heat transfer.
  • To ensure reliable operation at high temperatures, it's essential to follow Nexperia's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and adequate airflow. Additionally, consider derating the device's power handling at high temperatures.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To protect PEMD9009,115 from EOS, use proper circuit protection devices such as TVS diodes or zener diodes to clamp voltage transients. Additionally, ensure that the device is operated within its recommended voltage and current ratings.
  • Store PEMD9009,115 in a dry, cool place, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or electrical contacts. Use anti-static wrist straps, mats, or bags to prevent electrostatic discharge (ESD) damage.

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PEMD9,115 Overview

Use the download button to access the PEMD9,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PEMD9, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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