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PGA113AIDGSR - Texas Instruments

Description: Zero-Drift, Programmable Gain Amplifier with MUX

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PGA113AIDGSR - Texas Instruments - PCB symbol
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PCB Footprints
PGA113AIDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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PGA113AIDGSR - Texas Instruments - 3D model - Small Outline Packages - DGS0010A
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PGA113AIDGSR Details

  • Manufacturer Part Number:

    PGA113AIDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    1.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

PGA113AIDGSR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the power supply and keep the power traces away from the analog signals.
  • Handle the device by the body, not the pins. Use an anti-static wrist strap or mat to prevent electrostatic discharge. Avoid touching the pins or exposing the device to moisture, extreme temperatures, or physical stress.
  • Power up the device in the following sequence: AVDD, DVDD, and then the analog input signal. Ensure that the power supplies are stable and within the recommended voltage range before applying the analog input signal.
  • Use a low-noise power supply, keep the analog input signal away from digital signals, and use a ground plane to reduce electromagnetic interference. Also, use a capacitor (e.g., 10nF) between the analog input and ground to filter out high-frequency noise.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device and avoid blocking the airflow. Keep the device away from other heat sources and use a thermal interface material (e.g., thermal tape) to improve heat transfer.

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PGA113AIDGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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