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PIMD2,125 - Nexperia

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PIMD2,125 - Nexperia  - 3D model
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PIMD2,125 Details

  • Manufacturer Part Number:

    PIMD2,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP

  • Package Description:

    SC-74, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT457

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    60

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PIMD2,125 Frequently Asked Questions (FAQs)

  • Nexperia recommends a symmetrical PCB layout with a central ground plane, and keeping the input and output traces as short as possible. Additionally, using a 4-layer PCB with a dedicated ground plane can help reduce EMI and improve performance.
  • To ensure reliable operation at high temperatures, it's essential to follow Nexperia's recommended thermal design guidelines, including using a heat sink, ensuring good thermal conductivity, and avoiding thermal hotspots. Additionally, derating the device's power handling capabilities at high temperatures is crucial.
  • While the electrical characteristics remain the same, different package types can affect the device's thermal performance, power handling, and PCB layout requirements. For example, SOT23 packages have a larger thermal pad than SOT323, which can improve thermal performance. However, this may require adjustments to the PCB layout and thermal design.
  • Nexperia recommends using external ESD protection devices, such as TVS diodes or ESD arrays, to protect the PIMD2,125 from electrostatic discharge. Additionally, following proper handling and storage procedures, and using ESD-safe equipment and materials, can help prevent ESD damage.
  • While the PIMD2,125 is suitable for high-frequency applications, its performance may degrade above 1 GHz due to internal parasitics and package limitations. To mitigate this, Nexperia recommends using the device in a well-designed PCB layout, with careful attention to signal integrity, and considering the use of external components to compensate for high-frequency losses.

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PIMD2,125 Overview

Use the download button to access the PIMD2,125 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PIMD2, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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