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PMBF170,215 - Nexperia

Description: MOSFET

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PCB Footprints
PMBF170,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23
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3D Models
PMBF170,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23
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PMBF170,215 Details

  • Manufacturer Part Number:

    PMBF170,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.3 A

  • Drain-source On Resistance-Max:

    5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMBF170,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PMBF170,215 near a thermal pad or a heat sink, ensuring good thermal conductivity. The layout should also minimize thermal resistance by using wide copper tracks and avoiding thermal bottlenecks.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for PMBF170,215 involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. It's also essential to use a solder with a melting point above 217°C to prevent damage to the device.
  • To handle ESD protection for PMBF170,215, it's essential to follow proper ESD handling procedures, such as using ESD-safe workstations, wearing ESD-protective clothing, and using ESD-protective packaging materials. Additionally, consider implementing ESD protection circuits or devices in the system design.
  • When using PMBF170,215 in a high-reliability application, it's essential to consider the device's failure rate, which is typically specified in the datasheet. Additionally, consider implementing redundancy, error correction, and fail-safe mechanisms to ensure the system's reliability and availability.

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PMBF170,215 Overview

Use the download button to access the PMBF170,215 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for PMBF170,215, check out Findchips.com