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PMDPB70XPE,115 - NXP

Description: 20 V dual P-channel Trench MOSFET |6-UDFN Exposed Pad ,1.25V @ 250µA ,-55°C ~ 150°C (TJ)

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Symbol
PMDPB70XPE,115 - NXP - PCB symbol
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PCB Footprints
PMDPB70XPE,115 - NXP PCB footprint - Other - Other - SOT1118
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3D Models
PMDPB70XPE,115 - NXP - 3D model - Other - SOT1118
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PMDPB70XPE,115 Details

  • Manufacturer Part Number:

    PMDPB70XPE,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DFN

  • Package Description:

    SOT-1118, DFN2020-6, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT1118

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.079 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    77 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    8.33 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMDPB70XPE,115 Frequently Asked Questions (FAQs)

  • NXP recommends a PCB layout with a solid ground plane and thermal vias under the package to improve heat dissipation. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure reliable operation at high temperatures, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and avoiding thermal hotspots.
  • Exceeding the maximum junction temperature (Tjmax) can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range.
  • While the PMDPB70XPE,115 is designed to operate in a variety of environments, it's essential to follow NXP's recommendations for moisture sensitivity and handling to prevent damage. In high-humidity environments, consider using conformal coating or other protection methods.
  • The PMDPB70XPE,115 has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. NXP recommends using an ESD wrist strap or mat when handling the device.

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PMDPB70XPE,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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