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PMXB56ENZ - Nexperia

Description: MOSFET 30 V, N-channel Trench MOSFET

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PCB Footprints
PMXB56ENZ - Nexperia PCB footprint - Other - Other - DFN1010D-3 (SOT1215)_2022
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3D Models
PMXB56ENZ - Nexperia  - 3D model - Other - DFN1010D-3 (SOT1215)_2022
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PMXB56ENZ Details

  • Manufacturer Part Number:

    PMXB56ENZ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN1010D-3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT1215

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.95

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3.2 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMXB56ENZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure the system is designed to operate within the recommended temperature range.
  • Implement ESD protection measures, such as using ESD-sensitive handling procedures, anti-static wrist straps, and ESD-protected workstations. Ensure the PCB design includes ESD protection diodes and resistors.
  • Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the leads or die. Use anti-static materials and follow ESD-safe handling procedures.

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PMXB56ENZ Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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