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PMZ1200UPEYL - Nexperia

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PMZ1200UPEYL - Nexperia  - 3D model
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PMZ1200UPEYL Details

  • Manufacturer Part Number:

    PMZ1200UPEYL

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SC-101, DFN1006-3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT883

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.85

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.41 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMZ1200UPEYL Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component placement and routing away from the device can help reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device, and to ensure that the device is properly cooled. Additionally, using a thermally conductive material, such as a heat sink or thermal pad, can help to dissipate heat away from the device.
  • Exceeding the maximum junction temperature can lead to a reduction in the device's lifespan, and can cause permanent damage to the device. It can also lead to a decrease in the device's performance, and can cause it to malfunction or fail.
  • To protect the device from electrical overstress (EOS), it's essential to follow the recommended operating conditions, and to ensure that the device is not subjected to voltage or current spikes that exceed the maximum ratings. Additionally, using protection devices such as TVS diodes or zener diodes can help to protect the device from EOS.
  • The recommended storage and handling procedures for the device include storing the device in a dry, cool place, away from direct sunlight and moisture. The device should be handled with care to prevent mechanical damage, and should be stored in its original packaging or in a similar anti-static package.

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PMZ1200UPEYL Overview

Use the download button to access the PMZ1200UPEYL 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PMZ12, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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