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PS2513-1-A - Renesas Electronics

Description: Support is limited to customers who have already adopted these products.The PS2513-1 and PS2513L-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor. The PS2513-1 is in a plastic DIP (Dual In-line Package) and the PS2513L-1 is lead bending type (Gull-wing) for surface mount.

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PS2513-1-A - Renesas Electronics - PCB symbol
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PCB Footprints
PS2513-1-A - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PS2513-1
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PS2513-1-A - Renesas Electronics - 3D model - Dual-In-Line Packages - PS2513-1
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PS2513-1-A Details

  • Manufacturer Part Number:

    PS2513-1-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    DIP-4

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    120 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Current Transfer Ratio-Nom:

    125%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e1

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.03 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    MAGAZINE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.00006 s

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER COPPER

PS2513-1-A Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP6111) for the PS2513-1-A. It includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The PS2513-1-A has a thermal pad on the bottom of the package. Renesas recommends using a thermal via or a thermal pad on the PCB to dissipate heat. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • Renesas recommends using a 10uF to 22uF ceramic capacitor with an X7R or X5R dielectric as the input capacitor. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • The PS2513-1-A has a power-on reset (POR) circuit that ensures the device is properly powered up and powered down. The POR circuit is triggered by the VIN pin, and the device is enabled when VIN exceeds the POR threshold (typically 2.5V). To ensure proper power-up and power-down, the VIN pin should be ramped up and down slowly (typically 10ms to 100ms).
  • The EN pin is a digital input and should not exceed the maximum rating of 6V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a resistor divider network to ensure the EN pin voltage remains within the specified range.

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PS2513-1-A Overview

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