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PS2706-1-F3-A - Renesas Electronics

Description: The PS2706-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon darlington-connected phototransistor. This is mounted in a plastic SOP (Small Out-line Package) for high density applications. This package has shield effect to cut off ambient light.

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PS2706-1-F3-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PS2703-1-K-A-1
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PS2706-1-F3-A Details

  • Manufacturer Part Number:

    PS2706-1-F3-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-4

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    9

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    200%

  • Current Transfer Ratio-Nom:

    2000%

  • Dark Current-Max:

    400 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.2 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    AC INPUT-DARLINGTON OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.0002 s

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

PS2706-1-F3-A Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the datasheet, ensuring a solid ground plane, and using thermal vias to dissipate heat. Additionally, consider using a heat sink or thermal pad to reduce thermal resistance.
  • To ensure EMC and reduce EMI, follow the recommended PCB layout, use shielding, and implement filtering and decoupling techniques. Also, consider using a metal shield or a Faraday cage to enclose the device.
  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. For power-down, reverse the sequence. Ensure that the power supplies are stable and within the recommended voltage range.
  • Implement overvoltage protection using a voltage regulator or a zener diode, and undervoltage protection using a voltage supervisor or a reset IC. Ensure that the protection circuitry is designed to respond quickly to voltage fluctuations.
  • Consider the device's thermal characteristics, such as the junction-to-ambient thermal resistance (RθJA), and ensure good airflow or use a heat sink to dissipate heat. In high-temperature environments, consider using a thermal interface material and a heat sink with a high thermal conductivity.

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PS2706-1-F3-A Overview

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