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PS2911-1-F3-AX - Renesas Electronics

Description: The PS2911-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor in one package for high density mounting applications. An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 30% compared with the PS28xx series.

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PS2911-1-F3-AX - Renesas Electronics PCB footprint - Other - Other - 4-PIN ULTRA SMALL PACKAGE FLAT-LEAD
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PS2911-1-F3-AX - Renesas Electronics  - 3D model - Other - 4-PIN ULTRA SMALL PACKAGE FLAT-LEAD
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PS2911-1-F3-AX Details

  • Manufacturer Part Number:

    PS2911-1-F3-AX

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    100%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.04 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.12 W

  • Response Time-Max:

    0.000005 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

PS2911-1-F3-AX Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended thermal design guidelines in the datasheet.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable and within the recommended voltage range before applying the input signals.
  • Connect the analog ground (AGND) to the digital ground (DGND) at a single point, preferably near the power supply. Keep the analog and digital grounds separate on the PCB to minimize noise coupling.
  • The maximum allowable capacitance is 10uF. However, it's recommended to use 0.1uF to 1uF ceramic capacitors for optimal performance and noise reduction.

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PS2911-1-F3-AX Overview

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