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PS8502L3-AX - Renesas Electronics

Description: The PS8502, PS8502L1, PS8502L2 and PS8502L3 are 8-pin High-Speed photocouplers containing a GaAIAs LED on input side and a PN photodiode and a High-Speed amplifier transistor on output side on one chip. The PS8502 is in a plastic DIP (Dual In-line Package) with 8 mm creepage distance product. The PS8502L1 is lead bending type for long creepage distance. The PS8502L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. The PS8502L3 is lead bending type (Gull-wing) for surface mounti

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PS8502L3-AX - Renesas Electronics - PCB symbol
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PS8502L3-AX - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PS8502L3Gull-wing)
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PS8502L3-AX - Renesas Electronics - 3D model - Small Outline Packages - PS8502L3Gull-wing)
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PS8502L3-AX Details

  • Manufacturer Part Number:

    PS8502L3-AX

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    CMOS COMPATIBLE, UL APPROVED

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.025 A

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.008 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    LINEAR IC OUTPUT OPTOCOUPLER

  • Packing Method:

    MAGAZINE

  • Response Time-Max:

    8e-7 s

  • Response Time-Nom:

    2.2e-7 ns

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

PS8502L3-AX Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a heat sink or thermal pad, and ensure good airflow. Consider using a thermal interface material (TIM) to improve heat transfer. Monitor the junction temperature (TJ) and adjust the system design accordingly.
  • Use X5R or X7R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF capacitors. For output capacitors, use 4.7uF to 10uF capacitors.
  • Keep the switching node (SW) and input capacitors close to the IC. Use a shielded cable or a ferrite bead on the output cable to reduce EMI. Ensure a solid ground plane and use a common mode choke if necessary.
  • Apply VIN first, followed by EN (enable) and then VCC. Ensure a monotonic power-up sequence to prevent latch-up or damage to the device.

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PS8502L3-AX Overview

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