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PS9817A-2-F3-AX - Renesas Electronics

Description: The PS9817A-1 and PS9817A-2 are active-low type high-speed photocouplers that use a GaAlAs light-emitting diode on the input side and a photodetector IC that includes a photodiode and a signal processor on the same chip on the output side. The PS9817A-1 and PS9817A-2 are designed specifically for high common mode transient immunity (CMR) and low pulse width distortion. The PS9817A-2 is suitable for high density applications.

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PS9817A-2-F3-AX - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8
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PS9817A-2-F3-AX - Renesas Electronics  - 3D model - Small Outline Packages - SOIC 8
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PS9817A-2-F3-AX Details

  • Manufacturer Part Number:

    PS9817A-2-F3-AX

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    UL RECOGNIZED

  • Configuration:

    SEPARATE, 2 CHANNELS

  • Data Rate-Nom:

    10 MBps

  • Forward Current-Max:

    0.015 A

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    2

  • Number of Functions:

    2

  • On-State Current-Max:

    0.025 A

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Response Time-Nom:

    2e-8 ns

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

PS9817A-2-F3-AX Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.6 mm PCB thickness for optimal thermal performance.
  • Implement a robust power-on reset circuit, ensure a stable power supply, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices. Implement EMI filters and shielding on I/O lines, and consider using a common-mode choke for differential signals.
  • Use the device's low-power modes, optimize the clock frequency, and minimize unnecessary peripheral usage. Consider using a power gating technique and optimizing the system's power budget.
  • Perform environmental stress testing (EST), including temperature cycling, humidity, and vibration tests. Also, conduct functional testing, including boundary scan and JTAG testing, to ensure device reliability.

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PS9817A-2-F3-AX Overview

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