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PTLV9001IDBVR - Texas Instruments

Description: 1 - channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems

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PTLV9001IDBVR - Texas Instruments - PCB symbol
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PCB Footprints
PTLV9001IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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3D Models
PTLV9001IDBVR - Texas Instruments - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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PTLV9001IDBVR Details

  • Manufacturer Part Number:

    PTLV9001IDBVR

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 5 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    77 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    158489.3

  • Wideband:

    NO

  • Width:

    1.6 mm

PTLV9001IDBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal conductivity. A minimum of 2 oz copper thickness is recommended for the top layer.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using thermal interface materials, and keeping the device within its recommended operating temperature range.
  • The maximum output current capability of the PTLV9001IDBVR is 1.5 A per channel, but it's recommended to derate the output current based on the ambient temperature and thermal design to ensure reliable operation.
  • The output voltage of the PTLV9001IDBVR can be configured using external resistors (R1 and R2) connected to the VOUT pin. The output voltage can be calculated using the formula: VOUT = 1.2 V x (1 + R2/R1).
  • Texas Instruments recommends using a 10 μF to 22 μF ceramic capacitor with an X5R or X7R dielectric as the input capacitor. This helps to filter out noise and ensure stable operation.

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PTLV9001IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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