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PTN3356R1BSMP - NXP

Description: Video ICs SSL MATRIX CONTROLLER

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PCB Footprints
PTN3356R1BSMP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - hvqfn-32
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3D Models
PTN3356R1BSMP - NXP  - 3D model - Quad Flat No-Lead - hvqfn-32
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PTN3356R1BSMP Details

  • Manufacturer Part Number:

    PTN3356R1BSMP

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    5 X 5 MM, 0.85 MM HEIGHT, LEAD FREE, PLASTIC, MO-220, SOT617-3, HVQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT617-3

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    SEATED HEIGHT CONSIDERED NOMINAL

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    5 mm

PTN3356R1BSMP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor junction temperature (TJ) and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF for input and output filtering. Ensure the capacitors are rated for the maximum operating voltage and temperature range.
  • Use a shielded enclosure, keep sensitive components away from the PTN3356R1BSMP, and implement a multi-layer PCB with a solid ground plane. Ensure proper decoupling and filtering of power lines.
  • Follow the NXP-recommended soldering profile: peak temperature of 260°C, with a maximum dwell time of 30 seconds above 217°C. Ensure a controlled soldering process to prevent thermal damage.

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PTN3356R1BSMP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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