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PTN36001HXZ - NXP

Description: Dual Channel, SuperSpeed USB 3.0

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PTN36001HXZ Details

  • Manufacturer Part Number:

    PTN36001HXZ

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    X2QFN-12

  • Manufacturer Package Code:

    SOT1408-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2016-04-18

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • High Level Input Current-Max:

    0.000045 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • JESD-30 Code:

    R-PQCC-N12

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    0.5 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    0.5 ns

  • Width:

    1.25 mm

PTN36001HXZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 2 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Monitor input voltage, output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP).
  • Use a shielded enclosure, keep sensitive components away from the DC-DC converter, and use a common-mode choke to reduce EMI. Ensure proper grounding and decoupling.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 10 μF to 22 μF, depending on the input voltage and frequency.

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PTN36001HXZ Overview

Use the download button to access the PTN36001HXZ 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PTN36, or try a keyword search, such as Line Driver or Receivers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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