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PTN36241BBS,115 - NXP

Description: USB Interface IC USB3.0 SuperSpeed Re-driver

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PCB Footprints
PTN36241BBS,115 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN24_a
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3D Models
PTN36241BBS,115 - NXP  - 3D model - Quad Flat No-Lead - HVQFN24_a
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PTN36241BBS,115 Details

  • Manufacturer Part Number:

    PTN36241BBS,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOT616-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • JESD-30 Code:

    S-PQCC-N24

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    1 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1 ns

  • Width:

    4 mm

PTN36241BBS,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation, follow the recommended operating conditions, use a suitable thermal design, and consider using a thermal protection circuit to prevent overheating.
  • For EMI and EMC compliance, consider using a shielded enclosure, minimizing loop areas, using a common mode choke, and following good PCB layout practices to reduce emissions.
  • To troubleshoot issues, start by checking the power supply, verifying the input voltage, and monitoring the output voltage. Use an oscilloscope to check for noise, ringing, or other anomalies.
  • Using a different input or output voltage than recommended may affect the device's efficiency, reliability, and thermal performance. Consult the datasheet and application notes for guidance on voltage variations.

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PTN36241BBS,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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