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PUMD10,115 - Nexperia

Description: Nexperia, PUMD10,115, Dual NPN + PNP Digital Transistor, 100 mA 50 V 2.2 kΩ, Ratio Of 0.047, 6-Pin UMT

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Symbol
PUMD10,115 - Nexperia - PCB symbol
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PCB Footprints
PUMD10,115 - Nexperia PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (SOT363/SC-88)_
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3D Models
PUMD10,115 - Nexperia - 3D model - SOT23 (6-Pin) - (SOT363/SC-88)_
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PUMD10,115 Details

  • Manufacturer Part Number:

    PUMD10,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 21

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    230 MHz

PUMD10,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMD10,115 near a thermal pad or a heat sink, ensuring good thermal conductivity. Keep the component away from other heat sources and ensure good airflow around the device.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range (up to 150°C). Implement proper thermal management, such as heat sinks or thermal pads, and consider derating the device's power handling at higher temperatures.
  • The recommended soldering conditions for the PUMD10,115 are: peak temperature 260°C, soldering time 10 seconds, and a soldering method that prevents thermal shock. Follow the IPC-J-STD-020 standard for reflow soldering.
  • Handle the PUMD10,115 with ESD-protective equipment, such as wrist straps or mats, to prevent damage from electrostatic discharge. Ensure the device is stored in ESD-protective packaging when not in use.
  • The high current handling of the PUMD10,115 requires careful PCB design to ensure reliable operation. Use thick copper traces, wide tracks, and multiple vias to handle high currents. Ensure the PCB material can handle the high currents and temperatures generated by the device.

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PUMD10,115 Overview

Use the download button to access the PUMD10,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMD1, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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