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PUMD3,125 - Nexperia

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PUMD3,125 - Nexperia  - 3D model
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PUMD3,125 Details

  • Manufacturer Part Number:

    PUMD3,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PUMD3,125 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMD3,125 near a thermal pad or a heat sink, ensuring good thermal conductivity. A 2-layer or 4-layer PCB with a solid ground plane can help to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
  • Exceeding the maximum current rating can lead to overheating, reduced lifespan, and potentially even device failure. It's crucial to ensure that the current rating is not exceeded, and to implement overcurrent protection mechanisms to prevent damage.
  • To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits or devices in the design. Additionally, consider using a TVS (Transient Voltage Suppressor) diode or a Zener diode for added protection.
  • In high-humidity environments, the PUMD3,125 may be more susceptible to moisture-related issues. Ensure proper sealing or conformal coating, and consider using a moisture-resistant package or a humidity sensor to monitor the environment.

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PUMD3,125 Overview

Use the download button to access the PUMD3,125 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMD3, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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