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PUMH10,125 - Nexperia

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PUMH10,125 - Nexperia  - 3D model
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PUMH10,125 Details

  • Manufacturer Part Number:

    PUMH10,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 21

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PUMH10,125 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMH10,125 near a thermal pad or a heat sink, ensuring good thermal conductivity. The layout should also minimize thermal resistance by using thick copper tracks and avoiding thermal bottlenecks.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the PUMH10,125 involve using a soldering iron with a temperature of 350°C (662°F) for 3-5 seconds, with a maximum temperature of 370°C (698°F) for 1-2 seconds. It's essential to follow the soldering profile recommended by Nexperia to prevent damage to the device.
  • To protect the PUMH10,125 from electrostatic discharge (ESD), it's essential to follow proper ESD handling and storage procedures. This includes using ESD-safe materials, grounding oneself before handling the device, and storing the device in an ESD-protected environment.
  • When using the PUMH10,125 in a high-reliability application, it's essential to consider the device's failure modes, such as thermal runaway or electrical overstress. Implementing proper design margins, derating, and fault-tolerant design principles can help ensure the device's reliability in high-reliability applications.

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PUMH10,125 Overview

Use the download button to access the PUMH10,125 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMH1, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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