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PUMH11,115 - Nexperia

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PUMH11,115 Details

  • Manufacturer Part Number:

    PUMH11,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, SOT-363, TSSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    2.5 pF

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    230 MHz

  • VCEsat-Max:

    0.15 V

PUMH11,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMH11,115 near a thermal pad or a heat sink, ensuring good thermal conductivity. A 2-3 layer PCB with a solid ground plane and minimal thermal vias is recommended.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions for PUMH11,115 are: peak temperature 260°C, soldering time 10-30 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C.
  • Handle the device by the body, avoiding touching the leads or pins. Store the device in its original packaging or a similar protective container, away from direct sunlight, moisture, and extreme temperatures.
  • The PUMH11,115 has an ESD rating of HBM 2 kV and MM 200 V. Handle the device with ESD-protective equipment, such as wrist straps, mats, and bags, to prevent damage from electrostatic discharge.

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PUMH11,115 Overview

Use the download button to access the PUMH11,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMH1, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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