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PUMH9,165 - Nexperia

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PUMH9,165 Details

  • Manufacturer Part Number:

    PUMH9,165

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 4.7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PUMH9,165 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMH9,165 near a thermal pad or a heat sink, ensuring good thermal conductivity. A 2-3 layer PCB with a solid ground plane and a thermal relief pattern around the device can help dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power handling capabilities according to the datasheet's thermal derating curves.
  • The recommended soldering conditions for PUMH9,165 involve using a soldering iron with a temperature of 250°C to 260°C, with a soldering time of 3-5 seconds. It's essential to follow the IPC J-STD-020 standard for soldering and to use a solder with a melting point above 217°C.
  • To handle ESD protection for PUMH9,165, it's essential to follow proper ESD handling procedures, such as using ESD-safe workstations, wearing ESD-protective clothing, and using ESD-protective packaging materials. Additionally, consider implementing ESD protection circuits or devices in the design to prevent damage from electrostatic discharge.
  • When using PUMH9,165 in a high-reliability application, it's essential to consider the device's failure modes, such as thermal runaway or electrical overstress. Implementing redundant systems, error detection and correction mechanisms, and robust testing procedures can help ensure the reliability of the overall system.

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PUMH9,165 Overview

Use the download button to access the PUMH9,165 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMH9, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for PUMH9,165, check out Findchips.com