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QPL8834TR13 - Qorvo

Description: • Mid Gain: 12 dB at 1218 MHz • 5 – 1218 MHz BW • OIP3: +42 dBm, 50 – 1218 MHz • OP1dB: +24 dBm, 50 – 1218 MHz • Low Noise Figure: 4 dB, Full Band • Excellent Composite Distortion • pHEMT GaAs device technologies • Compact Size: 8-pin SOIC • Power Consumption: 5 V, 290 mA (1.45W) 8V, 365mA (2.92W)

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QPL8834TR13 - Qorvo PCB footprint - Small Outline Packages - Small Outline Packages - QPL1811SR
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QPL8834TR13 - Qorvo  - 3D model - Small Outline Packages - QPL1811SR
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QPL8834TR13 Details

  • Manufacturer Part Number:

    QPL8834TR13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    5A991.G

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    6.84

  • Characteristic Impedance:

    75 Ω

  • Construction:

    COMPONENT

  • Gain:

    12 dB

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Frequency-Max:

    1218 MHz

  • Operating Frequency-Min:

    5 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOP8,.25

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Surface Mount:

    YES

  • Technology:

    PHEMT

  • VSWR-Max:

    1.28

QPL8834TR13 Frequently Asked Questions (FAQs)

  • Qorvo provides a recommended PCB layout guide for the QPL8834TR13, which includes guidelines for component placement, trace routing, and grounding. It's essential to follow this guide to ensure optimal performance, low noise, and minimal electromagnetic interference (EMI).
  • The QPL8834TR13 has a thermal pad on the bottom of the package, which requires proper thermal management to prevent overheating. A thermal via or a heat sink can be used to dissipate heat. The recommended thermal resistance (θJA) is 25°C/W. Ensure that the PCB design and thermal management strategy are adequate to keep the junction temperature below 125°C.
  • The QPL8834TR13 requires input and output matching networks to achieve optimal performance. Qorvo provides a recommended matching network design in the application note, which includes component values and layout guidelines. The matching network should be optimized for the specific frequency band and impedance requirements of the application.
  • The QPL8834TR13 is a ruggedized device, but it still requires proper handling and assembly to ensure reliability in harsh environments. Follow Qorvo's recommended assembly and handling procedures, and ensure that the device is properly soldered and cleaned. Additionally, consider using conformal coating and potting compounds to protect the device from moisture and mechanical stress.
  • The QPL8834TR13 is a sensitive device that requires proper ESD protection and handling. Follow Qorvo's recommended ESD handling procedures, which include using ESD-safe workstations, wrist straps, and packaging materials. Ensure that the device is properly grounded during handling and assembly to prevent electrostatic discharge damage.

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QPL8834TR13 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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