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QS6M4TR - ROHM Semiconductor

Description: 2.5V Drive Nch+Pch MOSFET

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PCB Footprints
QS6M4TR - ROHM Semiconductor PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSMT6_2022
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3D Models
QS6M4TR - ROHM Semiconductor  - 3D model - SOT23 (6-Pin) - TSMT6_2022
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QS6M4TR Details

  • Manufacturer Part Number:

    QS6M4TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TSMT6, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.5 A

  • Drain-source On Resistance-Max:

    0.245 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.25 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

QS6M4TR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature (Tj).
  • The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage may cause permanent damage.
  • Use an ESD wrist strap or mat during handling and assembly. Ensure that the device is stored in an anti-static bag or tube to prevent electrostatic discharge damage.
  • The recommended soldering temperature profile is 260°C for 10 seconds, with a peak temperature of 240°C. Use a soldering iron with a temperature control to prevent overheating.

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QS6M4TR Overview

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