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R5F211B1DD#U0 - Renesas Electronics

Description: The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high

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R5F211B1DD#U0 - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PRDP0020BA-A
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R5F211B1DD#U0 - Renesas Electronics  - 3D model - Dual-In-Line Packages - PRDP0020BA-A
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R5F211B1DD#U0 Details

  • Manufacturer Part Number:

    R5F211B1DD#U0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SDIP

  • Package Description:

    6.30 X 19 MM, 1.78 MM PITCH, PLASTIC, SDIP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PRDP0020BA

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 2.7V AT 10MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    R8C

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDIP-T20

  • Length:

    19 mm

  • Number of I/O Lines:

    16

  • Number of Terminals:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SDIP

  • Package Equivalence Code:

    SDIP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    384

  • ROM (words):

    4096

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    4.5 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.778 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F211B1DD#U0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization of the internal voltage regulators and prevents latch-up.
  • The clock settings can be configured using the Clock Control Register (CCR). The CCR allows you to select the clock source, divide the clock frequency, and enable or disable the clock output. Refer to the user manual for detailed instructions.
  • The maximum operating temperature range for the R5F211B1DD is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The R5F211B1DD has a built-in watchdog timer that can be enabled and configured using the Watchdog Timer Control Register (WTCR). The watchdog timer can be used to detect and recover from system failures or hangs.
  • The maximum current consumption of the R5F211B1DD depends on the operating frequency, voltage, and peripheral usage. Refer to the datasheet for the typical current consumption values under different operating conditions.

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R5F211B1DD#U0 Overview

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