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R5F211B1DSP#U0 - Renesas Electronics

Description: The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high

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R5F211B1DSP#U0 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PLSP0020JB-A
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R5F211B1DSP#U0 - Renesas Electronics  - 3D model - Small Outline Packages - PLSP0020JB-A
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R5F211B1DSP#U0 Details

  • Manufacturer Part Number:

    R5F211B1DSP#U0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LSSOP

  • Package Description:

    4.40 X 6.50 MM, 0.65 MM PITCH, PLASTIC, LSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PLSP0020JB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 2.7V AT 10MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Number of I/O Lines:

    16

  • Number of Terminals:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    384

  • ROM (words):

    4096

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.45 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F211B1DSP#U0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization of the device.
  • The clock settings can be configured using the Clock Control Register (CCR). The CCR allows you to select the clock source, divide the clock frequency, and enable or disable the clock output.
  • The maximum operating frequency of the R5F211B1DSP is 32 MHz. However, the actual operating frequency may be limited by the system clock source and the clock divider settings.
  • The R5F211B1DSP supports a range of DSP instructions, including multiply-accumulate (MAC) and digital signal processing (DSP) instructions. These instructions can be used to accelerate DSP algorithms and improve system performance. Refer to the user manual for more information on using DSP instructions.
  • The internal voltage regulator on the R5F211B1DSP is used to generate the internal voltage (VDD) from the external voltage supply (VCC). This allows the device to operate with a single external power supply voltage.

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R5F211B1DSP#U0 Overview

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