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R5F211B4NP#U0 - Renesas Electronics

Description: The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high

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R5F211B4NP#U0 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PWQN0028KA-B
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R5F211B4NP#U0 - Renesas Electronics  - 3D model - Quad Flat No-Lead - PWQN0028KA-B
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R5F211B4NP#U0 Details

  • Manufacturer Part Number:

    R5F211B4NP#U0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    HWQFN

  • Package Description:

    HVQCCN, LCC28,.2SQ,20

  • Pin Count:

    28

  • Manufacturer Package Code:

    PWQN0028KA

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 2.7V AT 10MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    R8C

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQCC-N28

  • Length:

    5 mm

  • Number of I/O Lines:

    16

  • Number of Terminals:

    28

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1024

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.8 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F211B4NP#U0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures that the internal voltage regulators and clock circuitry are properly initialized.
  • The clock source can be configured using the Clock Control Register (CKCR). The R5F211B4NP#U0 can use an external clock source, internal high-speed clock (HOCO), or internal low-power clock (LOCO). The default clock source is the internal HOCO.
  • The maximum operating frequency of the R5F211B4NP#U0 is 32 MHz, but it can be operated at lower frequencies to reduce power consumption.
  • The WDT can be enabled and configured using the Watchdog Timer Control Register (WDTCR). The WDT can be used to reset the microcontroller if it fails to respond within a specified time period.
  • The built-in flash memory can be used to store program code, data, and configuration settings. It is divided into several blocks, including a boot block, data flash, and user flash.

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R5F211B4NP#U0 Overview

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