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RAL025P01TCR - ROHM Semiconductor

Description: 1.5V Drive Pch MOSFET

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PCB Footprints
RAL025P01TCR - ROHM Semiconductor PCB footprint - Other - Other - TUMT6
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3D Models
RAL025P01TCR - ROHM Semiconductor  - 3D model - Other - TUMT6
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RAL025P01TCR Details

  • Manufacturer Part Number:

    RAL025P01TCR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TUMT6, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    2.5 A

  • Drain-source On Resistance-Max:

    0.062 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RAL025P01TCR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm with multiple vias to the ground plane to ensure efficient heat dissipation. Additionally, keeping the PCB layer stack-up symmetrical and using a solid ground plane can help reduce thermal resistance.
  • To ensure reliability, follow the recommended operating temperature range (Ta = -40°C to 125°C) and derate the power dissipation according to the temperature coefficient. Also, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a temperature slope of 3°C/s. It's essential to follow the recommended soldering conditions to prevent damage to the device.
  • The RAL025P01TCR is not specifically designed for high-humidity environments. However, if you must use it in such conditions, ensure the device is properly sealed or coated to prevent moisture ingress. Additionally, consider using a moisture-resistant PCB material and follow proper PCB assembly and storage procedures.
  • The expected lifespan of the RAL025P01TCR depends on various factors, including operating temperature, power dissipation, and environmental conditions. Under normal operating conditions, the device can last for 10-15 years or more. However, it's essential to follow proper design and application guidelines to ensure the device's reliability and longevity.

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RAL025P01TCR Overview

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