A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Use a reflow soldering process with a peak temperature of 240°C for 10-30 seconds. Ensure the device is centered on the PCB and the solder paste is evenly distributed.
The device can operate safely between -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C.
Yes, but ensure the device is properly sealed and conformal coated to prevent moisture ingress. ROHM recommends a moisture sensitivity level (MSL) of 3.
Store the device in its original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body, not the leads.
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RAL035P01TCR Overview
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