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RE1E002SPTCL - ROHM Semiconductor

Description: 4V Drive Pch MOSFET

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PCB Footprints
RE1E002SPTCL - ROHM Semiconductor PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-416FL_EMT3F
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3D Models
RE1E002SPTCL - ROHM Semiconductor  - 3D model - SO Transistor Flat Lead - SOT-416FL_EMT3F
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RE1E002SPTCL Details

  • Manufacturer Part Number:

    RE1E002SPTCL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, EMT3F, SC-89, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.25 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RE1E002SPTCL Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A 2-3 layer PCB with a solid ground plane is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good airflow. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • To prevent damage, handle the device by the body and not the leads. Avoid bending or twisting the leads, and store the device in a dry, cool place away from direct sunlight. Use anti-static packaging and follow ESD precautions when handling the device.
  • To troubleshoot issues, start by checking the device's operating conditions, such as voltage, current, and temperature. Verify that the device is properly soldered and that the PCB layout is correct. Use a thermal camera or thermometer to check for hotspots, and consult the datasheet and application notes for guidance.
  • For high-reliability applications, consider using a device with a higher temperature rating, such as the RE1E002SPTCL. Ensure that the device is operated within its recommended specifications, and follow a robust design and testing process to ensure reliability. Consult with ROHM Semiconductor's application engineers for guidance on high-reliability applications.

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RE1E002SPTCL Overview

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